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Old 04-08-2008, 08:35 PM   #5
Kougar
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I hope the same, but I am not counting on it. Doubly so with waterblocks, as they need to modify the base of their coolers.

Having almost 2x the heatspreader surface area may be a good thing to mitigate the extra heat (And I am very sure Nehalem will be a hot chip for several specific reasons), but it also means it will take new baseplate designs along with new mounting bracket designs...

Could also wonder how many more heatpipes they might use too, since they can squeeze in many more than currently possible now...

INQ released this, check out that industrial strength socket http://www.theinquirer.net/gb/inquir...es-nehalem-cpu
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